Telecommunications press release

Wed, 03 Dec 2008
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TTSL launches services in Jammu & Kashmir Circle

Company to invest Rs 100 crore -Phase I to connect 29 key towns...

Tue, 02 Dec 2008
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Mr. Rajiv Agarwal honored with "Retail Professional of the Year" award at The Star Retailer Awards 2008

The MobileStore also bags "The Durables Retailer of the Year" award...

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Huawei to Build China Unicom's First 40G WDM Transport Network

Huawei's 40G WDM solution four times faster than most current transport data rates...

Mon, 01 Dec 2008
Tue, 25 Nov 2008
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Obopay annouces new president for Asia & Africa

Mr. Chandnani brings with him more than 28 years of stellar top managerial experience focused onConsumer, Banking & Technology sectors by virtue of having held multiple strategic & leadership roles in leading blue chip organizations like Citi...

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Radware Helps ibibo to Deliver Next-Generation Network in India

One of India's fastest growing dotcoms deploys Radware's AppDirector 1000 to ensure customer satisfaction through a high-performance mission critical infrastructure...

Mon, 24 Nov 2008
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Television expected to drive Broadband

5th Broadband Tech India 2008...

Fri, 21 Nov 2008
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BPL Mobile empowers Mumbai Police to track drunk drivers

BPL Mobile is in the process of developing this valuable service further wherein the provision of onsite registration of offences will not be restricted only to drinking and driving. The service will assist Mumbai Police to take the same action for o...

Thu, 20 Nov 2008
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GL Announces Enhanced T1 E1 Products and Software

GL Communications Inc. announced today the release of T1 E1 Analyzer Software Version 5.18 with new applications and enhancements....

Tue, 18 Nov 2008
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Next Generation of Monolithically Integrated Mobile Phone Chip is Optimized for Lowest System Costs and a Five Times Better Performance; And Infineon Offers Ultra-Low Cost Dual SIM Integrated on a Single Platform

Infineon today introduced its latest chips for Ultra-Low Cost mobile phones, optimizing system performance by a factor of 5 and reducing the bill-of-material (BOM) by 10 %. Infineon also announced its new Ultra-Low Cost Dual-SIM platform XMM1028, whi...