IDT Announces Industry's First 3200 MT/s Compliant Chipset for LRDIMM, RDIMM and NVDIMM

The Latest IDT Chipset Integrates Advanced Features to Scale DDR4 Speeds and Densities to New Levels

San Jose, California, May 18, 2017 /India PRwire/ -- Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI) today announced sampling of its 4RCD0232K register and 4DB0232K data buffer to customers and ecosystem partners. The chipset integrates new features recently incorporated into the latest generation of the JEDEC standard defined for 3200 MT/s capability devices including decision feedback equalization (DFE), dedicated NVDIMM communication ports and fine granularity output signal ring-back control. Along with new features and performance enablers, the chipset also delivers the lowest power of any DDR4 chipset in the industry today.

As speeds of multi-slot memory subsystems increase, ring-back and cross-talk compromise the quality of the signal voltage amplitude thereby making it difficult to recognize the logic level of the signal. DFE is a technique that recovers the original signal from the noise, making it much stronger as shown in Figure 1. While DFE was only recently incorporated into the JEDEC standard, IDT has supported this feature as a proprietary performance enhancement for the previous 2 generations of devices. IDT has been working for several years with key eco-system partners and controller vendors to facilitate development of the necessary system training software and firmware to fully realize the benefits of DFE and, as such, was a major proponent of its incorporation into the latest specification revision.

IDT also incorporates a suite of features targeted towards enhancing density and performance of NVDIMMs. New communication interfaces between the chipset and NVDIMM controller as well as automated state machines for fast, reliable recovery during catastrophic power loss enable a new generation of fault tolerance and performance acceleration in servers and storage. Beyond density and performance, the chipset also saves cost by integrating a number of external components used in previous NVDIMM generations. The chipset pairs seamlessly with IDT's recently announced P8800 NVDIMM PMIC to provide a complete solution with programmable support for power sequencing, voltage failover and backup supply conservation.

"This IDT chipset is the culmination of our efforts over the last few years to scale DRAM and storage class memory solutions to the next level of bandwidth and density," said Rami Sethi, vice president and general manager of IDT's memory interface division. "IDT has worked closely with our customers and ecosystem partners to bring techniques common in high-speed serial receivers into the memory subsystem in order to continue scaling multi-slot topologies to higher and higher speeds."

"Micron is currently qualifying IDT DDR4 3200 register and data buffer engineering samples," said Malcolm Humphrey, vice president of marketing for Micron's compute and networking business unit. "This chipset enables cost-effective LRDIMM 3200 solutions as well as the potential to scale our NVDIMM designs to higher speeds."

The latest chipset from IDT is verified to be fully compliant to the published JEDEC specifications. For more information about IDT's DDR4 solutions, visit www.idt.com/go/DDR4.

Notes to Editor

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers' applications. IDT's market-leading products in RF, high performance timing, memory interface, real-time interconnect, optical interconnect, wireless power, and SmartSensors are among the company's broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol "IDTI." Additional information about IDT can be found at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, YouTube and Google+.

© 2017, Integrated Device Technology, Inc. IDT and the IDT logo are trademarks or registered trademarks of Integrated Device Technology, Inc, and its worldwide subsidiaries. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.

To view the image associated with this press release, please visit the following link: http://media3.marketwire.com/docs/DFEimage.jpg

Journalists and Bloggers
Visit India PRwire for Journalists for releases, photos, email alerts and customized feeds just for Media.

If you have any query regarding information in the press releases, please contact the company listed in the press release itself. Please do not call India PRwire, we will be unable to assist you with your inquiry.


Integrated Device Technology, Inc. recent press release(s)


IDT Expands Sensor Portfolio with Solid-State Flow Sensor Modules for Liquids and Gases

MEMS-based Digital Flow Sensor with Silicon-Carbide Coating is Industry's Most Robust and Reliable Solution Also Compatible with Food-Grade Applications

IDT's Flexible Timing Solution Provides Valuable Design Margin for 10Gbps, and 40/100Gbps Multi-lane Interfaces

Highly-Programmable Clock Generator and Jitter Attenuator IC Features sub-200fs Phase Noise to Ease Design Constraints and Lower Total System Costs

IDT Wins Prestigious Ericsson Semiconductor Supplier Award 2017

Award Received in Recognition of Excellent and Consistent Performance and for Supporting Technology Leadership in Mobile Broadband and Evolution to 5G

IDT Selected to Provide High-Efficiency Wireless Power Solution for LG's Latest Flagship Smartphone, G6

The Latest Version of the Company's Flagship Smartphone is a Sleek Feature-Rich Device that Brings the Convenience of Wireless Charging

IDT Appoints Andy Lai as Vice President of Sales, Greater China and South Asia Pacific, and Country Manager for China

With More than 25 Years in the Semiconductor Industry, Andy Lai is a Leading Sales Executive in the Greater China & South Asia Pacific